Extreme Ultraviolet (EUV) Lithography Market is expected to increase at a compound annual growth rate (CAGR) of 11.4% from 2025 to 2035

 

The market for extreme ultraviolet lithography market is estimated to be worth USD 12.42 billion in 2024 and is expected to increase at a compound annual growth rate (CAGR) of 11.4% from 2025 to 2035, reaching USD 40.72 billion. Unlike previous DUV technology, which requires multi-patterning—a technique that divides a single circuit layer into two or more independent masks and exposures to get the necessary resolution—EUV lithography allows printing of tiny features with a single exposure.

High-contrast patterns are used in extreme ultraviolet (EUV) lithography, a method that creates integrated circuits (ICs) at the most sophisticated semiconductor process nodes. It is the most precise kind of lithography, enabling further semiconductor downsizing.

 

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GROWTH DRIVERS

The ongoing need for deep learning processors and AI accelerators is the primary driver of the EUV lithography business. High-bandwidth memory (HBM) and massive parallel processing capability are required for AI models. To accommodate massive parallel processing tasks, these computers require billions of transistors crammed into tiny spaces. The only technology that can create the dense metal layers and gate architectures required for these expensive chips is EUV lithography. For AI chips to achieve the clock speeds and power efficiency needed for training huge language models, EUV accuracy is crucial.

A new generation of System-on-Chip (SoC) architectures for base stations and smartphones is required due to the global rollout of 5G networks. To manage the increased power consumption of 5G modems while maintaining a tiny form factor, these SoCs must be remarkably energy-efficient. EUV lithography enables the creation of chips with higher performance per watt and reduced power leakage. Because of this, smartphone makers are increasingly utilizing 3nm and 5nm CPUs to set their flagship devices apart with longer battery life and improved computational photography.

MARKET SEGMENTATION:

By Component -

·         Light Sources

·         EUV Optics

·         EUV Masks

·         Other Components

By System Type –

·         0.33 NA EUV Systems (NXE)

·         0.55 NA EUV Systems (EXE)

By Application Nodes –

·         7 NM

·         5 NM

·         3 NM

·         2 NM

·         SUB-2 NM

By Application –

·         Logic Chips

o   CPU (Desktop/Server/Mobile)

o   GPU

o   Al Accelerator (TPU, NPU, etc.)

o   SoC (Mobile, Automotive)

o   ASIC / Custom Logic

·         Memory Chip

o   DRAM

o   High-Bandwidth Memory (HBM)

By End-User –

·         Integrated Device Manufacturers (IDMs)

·         Foundries

By Region -

·         North America

·         Europe

·         Asia Pacific

·         Latin America

·         Middle East & Africa

 

Key Players:

·         ASML

·         KLA Corporation

·         ZEISS Group

·         TRUMPF

·         AGC Inc.

·         Lasertec Corporation

·         HOYA Corporation

·         Applied Materials, Inc.

·         Ushio Inc.

·         NTT Advanced Technology Corporation

·         Rigaku Holdings Corporation

·         Other Key & Niche Players

 

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